Fabrication¶
1. Introduction¶
The fabrication phase of the Iktishaf project involved a combination of digital and manual processes to bring the module designs to life. Each module was constructed using soft materials and embedded electronics, requiring careful coordination between laser cutting, vinyl cutting, and hand assembly.
This section documents the full fabrication workflow—from preparing material tests and setting up machines, to assembling the modules and integrating components. The goal was to ensure that each module was not only functional and safe for children, but also durable, visually clear, and easy to interact with.
Fabrication was carried out in stages: first cutting the textile layers, then preparing and attaching electronic elements such as sensors, PCBs, and conductive paths, followed by applying snaps and final gluing. The result is a robust set of soft, interactive modules that connect through snap buttons and can be easily manipulated by learners of all ages.
2. Laser Cutting¶
To begin the fabrication of the modules, a new textile material was selected as the main construction layer. Since different fabrics respond differently to laser processing, a series of tests were carried out to determine the optimal cutting and engraving settings for clean edges, minimal fraying, and readable vector engravings.
Small test patches of the chosen fabric were used to evaluate:
- Cut quality (edge sharpness and cleanliness)
- Engraving visibility (depth and contrast without burn-through)
- Fabric behavior (shrinkage, smoke residue, melting)
Once the settings were finalized, all module files were prepared in Rhino, with separate layers for cutting and engraving. These files were sent directly to the Trotec JobControl software, which interprets layer colors and assigns corresponding power, speed, and pass values based on material presets.
Cutting the Broadcloth Fabric¶
The modules were laser cut from broadcloth in stacked batches to speed up the workflow. Each module included:
- Outer shape cut line
- Snap connector hole cutouts
- Engraved icons and labels (logic symbols, sensor icons, etc.)
Laser cutting was used not only for precision, but also to ensure that all modules were consistent in size and layout, reducing variation during assembly.
Cutting the Silver Conductive Fabric¶
In addition to the main fabric, silver conductive fabric was laser cut to produce:
- Traces for the breadboard-style mat
- Conductive paths inside jumper modules
Due to its delicate and lightweight nature, the silver fabric was first taped onto a scrap piece of wood to prevent shifting during cutting. Once secured, narrow strips and custom-shaped traces were cut cleanly and without fraying, ensuring accurate fit and reliable conductivity in the final assembly.
Laser Cutting Settings Used¶
| Material | Function | Power (%) | Speed (%) | Passes | Notes |
|---|---|---|---|---|---|
| Broadcloth | Cutting outline | 35 | 2.0 | 1 | Clean single pass, low fray |
| Broadcloth | Engraving symbols | 15 | 10.0 | 1 | Good contrast, no burn-through |
| Silver conductive fabric | Cutting strips | 15 | 1.0 | 1 | Taped to wood to prevent movement |
Note: Settings may vary slightly depending on fabric batch and machine calibration. These values were based on the Trotec Speedy 100 60W laser cutter.
This process ensured all layers, both conductive and structural were cut precisely and prepared for smooth integration into the next stages of assembly.
3. Vinyl Cutting (Touch Sensor)¶
To create the flat capacitive surface for the Touch Sensor Module, a vinyl cutter was used to cut a precise and consistent pattern from copper tape. This method allowed for rapid and clean fabrication of the sensor’s conductive shape, ensuring accurate dimensions and good electrical performance when embedded inside the fabric.
Material & Purpose¶
The sensor was made using adhesive copper tape, which is thin, flexible, and conductive on both sides. It was chosen for its high conductivity, ease of adhesion, and compatibility with the vinyl cutter.
The goal was to cut a clean circular pad with connector arms that would later align with the snap terminals of the module.
Design & File Preparation¶
- The touchpad design was created and finalized in Inkscape.
- The shape consisted of a large circular sensing area with one thin "arm" extending to connect to the snap location.
- The file was exported as an SVG and loaded into the vinyl cutter software.
- Minor adjustments were made to line thickness and scale for accurate output.
Cutting Workflow¶
- A strip of copper tape was applied onto a cutting mat with its adhesive side down.
- The design file was sent from Inkscape to the vinyl cutter.
- Cut settings were carefully selected to avoid cutting through the tape’s backing:
- Blade Depth: 1–2
- Speed: Medium
- Force: Low
- After cutting, excess copper was removed (weeded), leaving behind the sensor shape.
Placement & Integration¶
- The cut copper sensor was peeled off its backing and carefully adhered to the inner side of the bottom fabric layer of the touch sensor module.
- The connector arms were aligned with the snap terminals to ensure solid electrical contact.
- The second fabric layer was placed over the copper, sealing the sensor within a soft textile sandwich.
This technique provided a reliable, thin, and fully integrated capacitive sensor with minimal bulk, ideal for soft electronics and textile-based interaction.
4. Snap Button Punching¶
Snap buttons were used throughout the Iktishaf kits as both mechanical connectors and electrical terminals. Proper placement and secure attachment were essential to ensure consistent and durable connections between modules.
Tools & Method¶
Snap buttons were attached using two types of metal punches in combination with a hammer and a solid backing surface.
The process involved two steps:
- Opening the Rivet:
- A sharp-tipped punch was used to carefully open up the rivet part of the snap.
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The punch was placed on the snap, and then lightly tapped with a hammer to spread the metal outward into the fabric layers.
-
Securing the Edges:
- A second flat/blunt-tipped punch was then used to press down and flatten the edges of the snap.
- This ensured the snap was locked tightly into place and flush with the fabric surface.
This two-step approach helped prevent tearing, ensured solid attachment, and reduced the risk of the snaps popping off during repeated use.
Placement & Alignment¶
Snap button positions were pre-marked in the module designs:
- All snap positions followed the 6 cm spacing grid, ensuring compatibility across the system.
- In jumper modules and the mat, snaps were aligned directly over conductive fabric traces to allow electrical continuity.
Ensuring Conductivity¶
For snaps that formed part of an electrical path (e.g., input/output pads, jumpers):
- Snaps were punched through conductive fabric or thread layers to ensure proper connection.
- After punching, each connection was tested using a multimeter for continuity.
- In some cases, copper or conductive tape was placed under the snap cap to improve contact with internal traces.
This manual punching process allowed for controlled, precise snap placement without the need for a snap press, making it well-suited for textile-based circuits and low-volume fabrication.
5. Module Assembly¶
Each module in the Iktishaf kits was assembled by layering conductive and non-conductive textiles, adding electronic components, and attaching snaps for connectivity. This section documents the purpose, parts used, and assembly process of each module, grouped by type.
5.1 Logic Gate Modules¶
These modules teach digital logic concepts using actual logic gate ICs and custom PCBs.
AND Gate¶
Purpose¶
Outputs HIGH only when both inputs A and B are HIGH.
Parts¶
- Custom PCB with SN74HC08N chip
- Two 10kΩ SMD resistors
- Fabric layers (broadcloth)
- Snap connectors (x3)
Assembly Process¶
OR Gate¶
NAND Gate¶
NOR Gate¶
5.2 Output Modules¶
LED Module¶
Purpose¶
Lights up when input is HIGH.
Parts¶
- Standard 5mm LED
- Fabric layers
- Snaps (VCC, GND)
RGB LED Module¶
Purpose¶
Produces multiple colors by controlling R, G, B inputs.
Motor Module¶
Purpose¶
Rotates or vibrates depending on wiring and motor type.
Buzzer Module¶
Purpose¶
Emits sound when powered.
5.3 Input Modules¶
Potentiometer¶
Purpose¶
Analog input that adjusts voltage.
Blow Sensor¶
Purpose¶
Detects air movement using a microphone circuit.
Capacitive Touch Sensor¶
Purpose¶
Triggers signal when touched by skin.
LDR (Light Sensor)¶
Purpose¶
Changes resistance based on light intensity.
Reed Switch¶
Purpose¶
Closes circuit when near a magnet (used with wand).
Push Button¶
Purpose¶
Digital input switch.
Force Sensor¶
Purpose¶
Detects pressure on surface.
5.4 Mini Makers Kit Modules¶
Ambulance¶
Purpose¶
Blinks red/blue LEDs using a 555 timer circuit.
School Bus¶
Purpose¶
Triggers buzzer when ultrasonic sensor detects proximity.
Helicopter¶
Purpose¶
Activates motor via reed switch.
Car¶
Purpose¶
Uses vibration motor to simulate movement.
Traffic Light¶
Purpose¶
LEDs light up in sequence using reed switches.
5.5 Battery Module¶
Purpose¶
Supplies 3–5V power to all modules.
Parts¶
- Battery holder
- Snap terminals
- Fabric housing
Assembly¶
5.6 Jumper Modules¶
Small Jumper¶
Medium Jumper¶
Large Jumper¶
Male-Female-Male Jumper¶
Purpose¶
Passively connects modules via snap buttons.
Parts¶
- Two (or three) snap connectors
- Conductive fabric strip
- Dark blue fabric cover
5.7 Breadboard-Style Mat¶
Purpose¶
Base layer for organizing and snapping modules in a circuit layout.
Parts¶
- Large piece of brown fabric
- Snaps arranged in 6 cm grid
- Conductive fabric traces (horizontal and vertical)
Assembly¶
- Laser cut and place conductive strips
- Secure all layers (glue)
- Add snap buttons
5.8 Microcontroller Module¶
Purpose¶
The Microcontroller Module serves as the programmable core of the Master Makers kit. It allows for dynamic control of sensors and outputs using code, enabling more advanced interaction, logic processing, and experimentation within the soft electronics system.
Parts¶
- Seeed Studio Xiao microcontroller (SAMD21)
- 90° male header pins (soldered directly to Xiao)
- Flexible hookup wires (soldered to selected pins on the headers)
- Snap connectors (for power, ground, and selected GPIO pins)
- Two layers of broadcloth
Assembly Process¶
- 90° male headers were soldered to the Xiao microcontroller to allow for a low-profile horizontal orientation inside the module.
- Wires were then soldered to the protruding pins of the headers—each wire leading to a corresponding snap connector position on the fabric.
- The microcontroller and wires were laid flat and secured to the bottom fabric layer, with careful routing to avoid crossing or tension.
- Snap connectors were punched through at the end of each wire for physical and electrical connection to other modules.
- The second fabric layer was added to enclose the components and maintain a clean, finished appearance.
Final Result¶
The finished module is compact and soft, with the Xiao securely embedded and its GPIO pins routed to snap connectors. It offers seamless integration with the rest of the system, allowing users to plug in inputs and outputs directly, while still being able to reprogram the device as needed. The design keeps the electronics protected and the interface approachable for learners.
